Peer Review History: Machine Capability Enhancement to Address Lacking Epoxy Coverage during Die Attach Process of QFN Packages

Editor(s):

(1) Dr. Guang Yih Sheu, Associate Professor, Chang-Jung Christian University, Taiwan.

Reviewers:

(1) Manu Mitra, University of Bridgeport, USA.

(2) Nida Tabassum Khan, Balochistan University of Information Technology, Pakistan.

Additional Reviewers:

(1) Oleg Dimitriev, V. Lashkaryov Institute of Semiconductor Physics, Ukraine.

Open Peer Review Policy: Click Here

Specific Comment:

Average Peer review marks at initial stage: 9.25/10

Average Peer review marks at publication stage: 9.75/10

Peer Review History:


Stage 1 | Original Manuscript | File 1 | NA


Stage 2 | Peer review report_1 (Manu Mitra, USA) | File 1 | NA


Stage 2 | Peer review report_2 (Nida Tabassum Khan, Pakistan) | File 1 | NA


Stage 2 | Revised_MS_v1_and_Feedback_v1 | File 1 | File 2


Stage 3 | Comment_Editor_1_v1 | File 1 | NA


Posted in Review History.